一区二区三区欧美-亚洲午夜精品-一区二区三区在线播放-欧美一区二区在线

D-Sub致密計算公式接觸器AMPHENOL

發(fa)表日子：2023-09-06 16:40:00     挑選：961

AMPHENOL的D-Subminiature高密度產品系列為線路板和電纜線末端提供各種線接選擇，明顯減少了電纜組件和連接器整體成本。接線端子包含板側的直立式、直角、SMT、電纜接頭和超薄型沉頭接線端子，及其電纜線側的焊杯、電纜接頭、IDC帶條狀、無焊繞線和螺母接線端子。各個線接規格都有插座和插頭連接器。

D-Sub高導熱系數拼接(jie)器直線PCB線接(jie)有不(bu)同封口空(kong)間布(bu)局(ju)樣式(shi)：歐(ou)州歸劃和航(hang)天(tian)軍工(gong)(gong)用(yong)(yong)空(kong)間布(bu)局(ju)。匹配(pei)區域接(jie)處表(biao)面能一直為金燦色，能表(biao)明必需要(yao)的不(bu)夠匹配(pei)聲(sheng)音頻率(lv)進行(xing)三類一般板(ban)厚：閃光彈金、15μ"和30μ"。打交(jiao)道點可提供數據緊密機械(xie)性(xing)生產(chan)制(zhi)造的軍工(gong)(gong)行(xing)業(ye)用(yong)(yong)級型號（穩定電(dian)流(liu)大小高至7.5A）以保險衛(wei)生正規性(xing)，怎么(me)樣才能夠給出(chu)更(geng)經(jing)濟條件(jian)且可商業(ye)應(ying)用(yong)(yong)的額定負載(zai)感應(ying)電(dian)流(liu)為3A的冷沖壓(ya)ios版本。

D-Sub密度高(gao)計(ji)算接(jie)(jie)器規格(ge)(ge)款型常從A到E的(de)(de)5種最基本外殼型號規格(ge)(ge)，AMPHENOL的(de)(de)搭配接(jie)(jie)觸器在數(shu)據表(biao)格(ge)(ge)信號燈、外接(jie)(jie)電(dian)源和同軸電(dian)覽方向存在高(gao)至18個玩(wan)點排布。堆(dui)疊（雙服務(wu)器端口）D-Sub高(gao)密度高(gao)的(de)(de)拼接(jie)(jie)器品牌系列表(biao)能(neng)比(bi)豐厚(hou)。AMPHENOL剛開發的(de)(de)代替PIP不銹(xiu)鋼焊(han)接(jie)(jie)細長(chang)（或沉(chen)式或短型）款型在AMPHENOL的(de)(de)商業服務(wu)玩(wan)家中獲取成就 。除(chu)此之余，AMPHENOL還還可為大多數(shu)運(yun)用(yong)提供數(shu)據專用(yong)裝備(bei)，涉及(ji)到金屬(shu)制(zhi)蓋、PVC防爆蓋、保障罩(zhao)、制(zhi)造專用(yong)裝備(bei)、懷孕天(tian)數(shu)轉化(hua)成和其他替換器。

特點

標D形對(dui)接器

EMI合金底(di)殼

插(cha)口一(yi)定接地系統凹(ao)坑(keng)

放進(jin)件由耐燃(ran)熱可(ke)塑(su)性(xing)塑(su)膠(jiao)片定制而成

運用企業章印遇到點

有(you)著全方向(xiang)線(xian)接范圍圖的變體

各種類型線接(jie)金橋銅業跨接(jie)線的截面積大(da)小均出具墻壁插(cha)(cha)座和插(cha)(cha)座

優勢

有效確(que)保正確(que)的搞好(hao)團結座向(xiang)

主要的使(shi)用大批量分娩(mian)但減節省成(cheng)本低(di)的改善計劃

UL#E232356審核

兼容(rong)多種(zhong)多樣客戶使用需求

具有標準國家標準

非常規(gui)系適于(yu)管腳焊錫膏(gao)或出(chu)液點焊

佛(fo)山市立維創展科持代(dai)辦經(jing)(jing)售AMPHENOL企業各科技(ji)領域產品(pin)一系列，在AMPHENOL，AMPHENOL想信在推進業務量的(de)(de)進程中(zhong)做到可不斷(duan)的(de)(de)抉擇可為股東的(de)(de)創建(jian)中(zhong)短(duan)期(qi)和(he)(he)(he)長久的(de)(de)交換價(jia)值。AMPHENOL的(de)(de)每條項國(guo)際業務都得(de)益于(yu)打造(zao)于(yu)連續不斷(duan)加強(qiang)其設汁，采(cai)購(gou)管控，制作和(he)(he)(he)支付(fu)類(lei)廠品(pin)的(de)(de)方式英文，拼命具(ju)備或超(chao)過老客戶(hu)對全部價(jia)值鏈中(zhong)類(lei)廠品(pin)管控的(de)(de)渴求。AMPHENOL 的(de)(de)業務員(yuan)將安全防護和(he)(he)(he)壞境保(bao)證算(suan)作重中(zhong)之重級任務，并按照ISO 14001和(he)(he)(he)OHSAS 18001等認同的(de)(de)標準(zhun)管理系統(tong)以下計劃表。有時候，證書和(he)(he)(he)法津合(he)規經(jing)(jing)營性還不是。AMPHENOL實(shi)際上(shang)僅(jin)尊守法律就能創建(jian)長期(qi)性的(de)(de)價(jia)值觀(guan)。

寶貝詳情學習AMPHENOL可點擊：//dev.www.zhixianguangzhou.com.cn/article/1321.html

AMPHENOL.png

PART NUMBER

DESCRIPTION

G17DC15023313HR

Dsub Slim Right Angle Dip, High Density 15 Position Receptacle VGA, Sunk 4.27mm, 15μin Au, Footprint 1.6mm, 2 Rows, Pitch 1.0mm, Post distance 1.4mm, PCB hole distance 2.3mm, Tail 3.05mm, Tape and Reel with Cap, Blue 661C, PIP, Halogon Free

G17DD1504232GHR

G17DD1504232GHR-Slim Right Angle Dip HD 15P Receptacle

G17DD1504232RHR

G17DD1504232RHR-Slim Right Angle Dip HD 15PReceptacle

G17DD1504232SHR

G17DD1504232SHR-Slim Right Angle Dip HD 15P Receptacle

L177HDA26S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDA26SD1CH3F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock

L177HDA26SD1CH3R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDA26SD1CH4F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

L177HDA26SD1CH4R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDA26SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDA26SVF

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock

L177HDAG26S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Without Bracket, Without Boardlock

L177HDAG26SOL2RM5

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAG26SOL2RM8

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock

L177HDAH26SOL2RM5

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Insert, 4-40 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SOL2RM8

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Fixed Front Screwlock, Standoff 6.0mm (0.236";), With Boardlock 4.2mm (0.165")

L177HDAH26SVF

Dsub, Stamped Signal 3A, Straight Soldercup, 26 Socket, Bright Tin Shell, 0.38m (15 in) Gold, 4-40 Removable Front Screwlock, 4-40 Threaded Nut

L177HDB44S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDB44SD1CH3F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock

L177HDB44SD1CH4F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

L177HDB44SD1CH4R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDB44SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDB44SVF

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock


介紹新聞咨詢
  • 關于THUNDERLINE-Z產品申明
    關于THUNDERLINE-Z產品申明 2020-10-14 15:54:05 廣州 市立維創展自動化有限制平臺，是美THUNDERLINE-Z & Fusite公司在國內的授權許可方法商，其金屬材質玻璃鋼封好絕緣端子，已常見選用于航空航天、軍事體育、通信技術等高可信度性區域。
  • CMD283C3超低噪聲MMIC放大器現貨庫存
    CMD283C3超低噪聲MMIC放大器現貨庫存 2025-08-22 16:41:29 Custom MMIC（現屬 Qorvo）的 CMD283C3 低好解決 MMIC 增加器主要采用 3x3 mm 無引線瓷磚 QFN 裝封，頻次范圍內 2 - 6 GHz，具備條件高增益控制、低解決、低工作頻率等性狀，適合于 S/C 股票波段多科技領域。